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US 2026/0304612 A1Published application
Wiring board
AssigneeKYOCERA Corporation
InventorsHiroaki SANO, Katsuya URABE, Michinobu NAKAMIYA, Masanori OKAMOTO, Akira IMOTO, Sentarou YAMAOTO
Life of this patent
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Abstract
A wiring board includes an insulation base and a conductor layer. In the insulation base a plurality of ceramic insulation layers are layered and integrated. The insulation base includes an inorganic coating film on a peripheral edge portion of the insulation base.
Claims17
A wiring board comprising:
- an insulation base in which a plurality of ceramic insulation layers are layered and integrated;
- and
- a conductor layer;
- wherein
- the insulation base includes an inorganic coating film on a peripheral edge portion of the insulation base.
2 more elements
Dependencies are inferred from the claim text.