H05K 2201/017
Glass ceramic coating
Official title: Glass ceramic coating, e.g. formed on inorganic substrate
H05K2201/017 (Glass ceramic coating) appears on 125 US grants and 120 published applications in this corpus.
Search patents in H05K- Granted patents
- 125
- Published applications
- 120
- Assignees
- 88
- Inventors
- 308
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 0 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 2 |
| 2004 | 3 | 0 |
| 2005 | 0 | 3 |
| 2006 | 1 | 7 |
| 2007 | 2 | 4 |
| 2008 | 1 | 6 |
| 2009 | 2 | 6 |
| 2010 | 6 | 3 |
| 2011 | 3 | 3 |
| 2012 | 4 | 7 |
| 2013 | 5 | 9 |
| 2014 | 6 | 6 |
| 2015 | 7 | 20 |
| 2016 | 10 | 2 |
| 2017 | 9 | 5 |
| 2018 | 6 | 8 |
| 2019 | 7 | 3 |
| 2020 | 4 | 11 |
| 2021 | 5 | 1 |
| 2022 | 0 | 1 |
| 2023 | 5 | 1 |
| 2024 | 3 | 5 |
| 2025 | 2 | 0 |
| 2026 | 2 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing a formed film14 Apr 2026US 12,604,397 B2Canatu Oy
- Electronic component17 Feb 2026US 12,557,212 B2Murata Manufacturing Co., Ltd.
- Circuit board25 Nov 2025US 12,484,147 B2Murata Manufacturing Co., Ltd.
- Wiring board16 Sep 2025US 12,418,980 B2Murata Manufacturing Co., Ltd.
- Laminated glass structures for electronic devices and electronic device substrates3 Sep 2024US 12,076,971 B2Corning Incorporated
- Wiring board1 Oct 2026US 2026/0304612 A1KYOCERA Corporation
- Glass Barrier Layer Product, and Manufacture Method30 Jul 2026US 2026/0223288 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Components-mounting substrate, components-mounting substrate manufacturing method, electronic module, and electronic module manufacturing method4 Jun 2026US 2026/0156757 A1NHK Spring Co., Ltd.
- Substrate structure21 May 2026US 2026/0143591 A1Unimicron Technology Corp.
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
Most cited
By later US patents
- Solder ball array and method of preparation135US 5,637,832 APacific Microelectronics Corporation · 1997
- Solder ball array97US 5,504,277 APacific Microelectronics Corporation · 1996
- Method of fabricating solder ball array90US 5,442,852 APacific Microelectronics Corporation · 1995
- Encapsulated electronic component having a heat diffusing layer73US 5,379,186 AMotorola, Inc. · 1995
- Method for making porous bottom-layer dielectric composite structure69US 4,724,021 AE. I. Du Pont de Nemours and Company · 1988