Method for making porous bottom-layer dielectric composite structure
AssigneeE. I. Du Pont de Nemours and Company
InventorsPaul J. Martin, Thomas E. Dueber
Life of this patent
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Abstract
A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of: (1) applying to a substrate a first and second layer of finely divided particles of dielectric solids and glass dispersed in organic medium; and (2) firing the layers to effect volatilization of the organic medium therefrom, liquid phase sintering of the glass components and densification of both layers, the softening point of the glass, the particle size of the glass and the ratio of glass to dielectric solids in both layers being adjusted in such manner that when the layers are fired, the first layer is porous and the second layer is nonporous.
Claims9
A method for inhibiting the formation of blisters during the firing of intermediate layers of fired multilayer electronic components comprising the sequential steps of:
- (1) applying to a substrate a first layer of finely divided particles of dielectric solids and glass dispersed in organic medium;
- (2) applying to the first dispersion layer a second layer comprising finely divided particles of glass dispersed in organic medium and
- (3) firing the layers to effect volatilization of the organic medium therefrom, liquid phase sintering of the glass components and densification of both layers, the softening point of the glass, the particle size of the glass and the ratio of glass to dielectric solids in both layers being adjusted in such manner that when the layers are fired, the sintering of the glass in the layers is such that upon completion of firing both layers, the first layer is porous and the second layer is nonporous, as measured by the Ink Adsorption Test.
Dependencies are inferred from the claim text.