Back to results
US 12,484,147 B2Granted
Circuit board
AssigneeMurata Manufacturing Co., Ltd.
InventorKumiko Ishikawa
Life of this patent
Estimating the term…
Abstract
A circuit board that includes a ceramic substrate; a protruding electrode on a surface of the ceramic substrate; and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate.
Claims14
A circuit board comprising:
- a ceramic substrate;
- a protruding electrode on a surface of the ceramic substrate, wherein the protruding electrode has a height of 50 μm to 300 μm, and a diameter of 100 μm to 300 μm;
- and a protective layer containing a metal oxide and covering at least a portion of a lateral surface of the protruding electrode and extending continuously across a boundary between the portion of the lateral surface of the protruding electrode and the surface of the ceramic substrate, wherein the protective layer has a thickness of 10 μm or more, a height of 15 μm or more from the surface of the ceramic substrate, and a coverage rate of 50% or more on the lateral surface of the protruding electrode.
Dependencies are inferred from the claim text.