Laminated glass structures for electronic devices and electronic device substrates
AssigneeCorning Incorporated
InventorsJin Su Kim, Dean Michael Thelen
Life of this patent
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Abstract
A laminated glass structure for an electronic device includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad glass layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to about 100 GHz.
Claims17
A laminated glass structure for an electronic device, comprising:
- a core glass layer having a first coefficient of thermal expansion (CTE);
- and
- a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer,
- wherein a first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer,
- wherein the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm, and
- further wherein each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to 100 GHz.
An electronic device, comprising:
- an electronic device substrate;
- and
- a plurality of electronic components disposed on the substrate,
- wherein the substrate comprises a laminated glass structure that comprises:
- a core glass layer having a first coefficient of thermal expansion (CTE),
- a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer,
- wherein a first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer,
- wherein the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm, and
- wherein the plurality of electronic components is disposed on the first of the clad layers, and further wherein each of the first of the clad layers and the core glass layer comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to 100 GHz.
An electronic device, comprising:
- an electronic device substrate;
- and
- a plurality of electronic components disposed on the substrate,
- wherein the substrate comprises a laminated glass structure that comprises:
- a core glass layer having a first coefficient of thermal expansion (CTE),
- a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer,
- wherein a first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer,
- wherein the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm and the thickness of the first of the clad glass layers is at least 0.05 mm, and
- wherein the plurality of electronic components are disposed on the first of the clad layers, and further wherein the first of the clad layers comprises a loss tangent of 0.006 or less for signals having a frequency of 1 GHz to 100 GHz.
Dependencies are inferred from the claim text.