Components-mounting substrate, components-mounting substrate manufacturing method, electronic module, and electronic module manufacturing method
AssigneeNHK Spring Co., Ltd.
InventorsKohei SUZUKI, Taro YUKIMASA, Kohei SHIMOMURA
Life of this patent
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Abstract
An electronic module that can prevent the occurrence of creeping discharge and whose mass producibility is improved. An electronic module has: a circuit board in which a metal layer, which structures wiring patterns, and a metal base are layered via an insulating layer; electronic components joined to the wiring patterns and a coating film formed at obverses and side surfaces of the electronic components and the circuit board by ceramic coating or glass coating.
Claims4
A components-mounting substrate, comprising:
- a circuit board in which a conductor layer, which structures wiring patterns, and a base substrate are layered via an insulating layer;
- electronic components joined to the wiring patterns;
- and
- a coating film formed at obverses and side surfaces of the electronic components and the circuit board by ceramic coating or glass coating.
A components-mounting substrate manufacturing method, comprising:
- preparing a mounting substrate main body having a circuit board in which a conductor layer, which structures wiring patterns, and a base substrate are layered via an insulating layer, and electronic components joined to the wiring patterns;
- and
- carrying out ceramic coating or glass coating on obverses and side surfaces of the electronic components and the circuit board.
An electronic module, comprising:
- a circuit board in which a conductor layer, which structures wiring patterns, and a base substrate are layered via an insulating layer;
- electronic components joined to the wiring patterns;
- a sealing resin sealing obverses and side surfaces of the electronic components and the circuit board;
- and
- a coating film formed at the obverses and the side surfaces of the electronic components and the circuit board by ceramic coating or glass coating, and interposed between the circuit board and the electronic components on the one hand and the sealing resin on the other hand.
An electronic module manufacturing method, comprising:
- preparing a components-mounting substrate having a circuit board in which a conductor layer, which structures wiring patterns, and a base substrate are layered via an insulating layer, and electronic components joined to the wiring patterns, and at which ceramic coating or glass coating is carried out on obverses and side surfaces of the electronic components and the circuit board;
- and
- sealing the obverses and the side surfaces of the electronic components and the circuit board by a sealing resin.
Dependencies are inferred from the claim text.