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US 5,504,277 AGranted
Solder ball array
AssigneePacific Microelectronics Corporation
InventorPaul A. Danner
Life of this patent
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AssigneePacific Microelectronics Corporation
InventorPaul A. Danner
Estimating the term…
An array of closely spaced uniform solder balls located on a substrate of an electronic module and electrically connected with terminals of circuitry, to connect the module to a complementary array of terminals as on a printed circuit board. The array is fabricated by preparing an array of terminal pads on the substrate, perforating a sheet of dielectric tape to create precise and uniform holes, and thereafter fusing the tape onto the substrate so that the holes are aligned over the substrate's terminal pads. Solder balls, each having a uniformly larger diameter than the respective hole, are then placed in the holes and heated to reflow them, so that a small part of each solder ball fills the volume defined by a hole in the dielectric tape and bonds to the terminal pad of the substrate within the hole, while the remainder of the solder ball remains generally spherical above the dielectric tape.
In an electronic circuit module including electrical circuit elements connected to an array of conductive terminal pads located on a substrate of said module, a solder ball array for electrically interconnecting said terminal pads on said substrate with a complementary array of terminals, said solder ball array comprising:
In an electronic circuit module including electrical circuit elements connected to an array of conductive terminal pads, a ball grid array assembly for electrically interconnecting said array of conductive terminal pads with an array of terminals, said ball grid array assembly comprising:
In an electronic circuit module including electrical circuit elements connected to an array of conductive terminal pads located on a substrate of said module, a solder ball array for electrically interconnecting said terminal pads on said substrate with a complementary array of terminals, said solder ball array comprising:
An electronic circuit structure including an array of terminals and an electronic circuit module including a plurality of electrical circuit elements connected to an array of conductive terminal pads located on a substrate of said module and a solder ball array electrically interconnecting said terminal pads on said substrate with said array of terminals, comprising:
Dependencies are inferred from the claim text.