US 2026/0143591 A1Published application

Substrate structure

AssigneeUnimicron Technology Corp.

InventorsYu-Hua Chen, Ra-Min Tain

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Abstract

A substrate structure including a dielectric substrate, an adhesion promotion layer (APL), a conductive material, at least one dielectric layer and at least one pad. The dielectric substrate has an upper surface and a lower surface opposite to each other, and at least one through-hole passing through the dielectric substrate and connected to the upper surface and the lower surface. The APL is disposed on the upper surface, on the lower surface, and on an inner wall of the through-hole of the dielectric substrate. The conductive material fills the through-hole to define at least one conductive through-hole. The dielectric layer is disposed on the APL and has at least one opening exposing the conductive through-hole. A diameter of the opening is greater than a diameter of the conductive through-hole. The pad is disposed in the opening, extends onto the dielectric layer, and electrically connected to the conductive through-hole.

Claims10

Dependent claims

A substrate structure, comprising:

a dielectric substrate, having an upper surface and a lower surface opposite to each other, and at least one through-hole passing through the dielectric substrate and connected to the upper surface and the lower surface;
an adhesion promotion layer, disposed on the upper surface, on the lower surface, and on an inner wall of the at least one through-hole of the dielectric substrate;
a conductive material, filling the at least one through-hole to define at least one conductive through-hole;
at least one dielectric layer, disposed on the adhesion promotion layer and having at least one opening exposing the at least one conductive through-hole, wherein a diameter of the at least one opening is greater than a diameter of the at least one conductive through-hole;
and
at least one pad, disposed in the at least one opening of the at least one dielectric layer and extending onto the at least one dielectric layer, wherein the at least one pad is electrically connected to the at least one conductive through-hole.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/239,854Filed 16 Jun 2025
Priority: TW 11411820715 May 2025
Published: 21 May 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H05K 1/116
Via connections; Lands around holes or via connections: lands, clearance holes or other lay-out details concerning the surrounding of a via
H05K 3/426
Characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern: initial plating of…
H05K 3/38
Apparatus or processes for manufacturing printed circuits: improvement of the adhesion between the insulating substrate and the metal
H10W 70/095
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: of vias therein