Encapsulated electronic component having a heat diffusing layer
AssigneeMotorola, Inc.
InventorsGlenn E. Gold, Anthony B. Suppelsa, Anthony J. Suppelsa
Life of this patent
Estimating the term…
Abstract
An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.
Claims8
An encapsulated electronic component having an integral heat diffuser, comprising:
- a substrate carrier;
- a heat producing electronic component mounted to the substrate;
- a first layer of encapsulant covering the electronic component;
- and
- a layer of aluminum nitride or beryllium oxide disposed directly on the encapsulant, said layer having greater thermal conductivity than the first layer of encapsulant.
An encapsulated electronic component having an integral heat diffuser, comprising:
- a printed circuit board;
- a heat producing electronic component mounted to the printed circuit board:
- a first layer of dielectric material encapsulating the electronic component, the dielectric material being a poor thermal conductor;
- and
- a heat diffusing layer of aluminum nitride disposed directly on the dielectric material, the heat diffusing layer having substantially greater thermal conductivity than the encapsulant layer.
An encapsulated electronic assembly having an integral heat diffuser, comprising:
- a printed circuit board;
- a plurality of heat producing electronic components mounted to the printed circuit board;
- a first layer of dielectric material encapsulating the plurality of electronic components and portions of the printed circuit board, the dielectric material selected from the group consisting of silicone elastomers, silicone gels, epoxy encapsulants, acrylics, silicon-carbon resins, and urethanes, and the dielectric material being a poor thermal conductor;
- a heat diffusing layer of aluminum nitride power or beryllium oxide power disposed directly on the dielectric material, the heat diffusing layer having substantially greater thermal conductivity than the encapsulant layer and having the property of being electrically non-conductive;
- and
- a second layer of dielectric material disposed directly on the heat diffusing layer, the second layer of dielectric material selected from the group consisting of silicone elastomers, silicone gels, epoxy encapsulants, acrylics, silicon-carbon resins, and urethanes.
Dependencies are inferred from the claim text.