H05K 2201/0162
Silicon containing polymer
Official title: Silicon containing polymer, e.g. silicone
H05K2201/0162 (Silicon containing polymer) appears on 298 US grants and 359 published applications in this corpus.
Search patents in H05K- Granted patents
- 298
- Published applications
- 359
- Assignees
- 234
- Inventors
- 888
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 6 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 2 |
| 2002 | 1 | 5 |
| 2003 | 3 | 6 |
| 2004 | 5 | 11 |
| 2005 | 7 | 10 |
| 2006 | 7 | 11 |
| 2007 | 5 | 13 |
| 2008 | 4 | 12 |
| 2009 | 8 | 10 |
| 2010 | 5 | 11 |
| 2011 | 5 | 13 |
| 2012 | 16 | 9 |
| 2013 | 6 | 15 |
| 2014 | 7 | 18 |
| 2015 | 14 | 28 |
| 2016 | 21 | 23 |
| 2017 | 21 | 25 |
| 2018 | 19 | 24 |
| 2019 | 23 | 27 |
| 2020 | 24 | 25 |
| 2021 | 26 | 20 |
| 2022 | 10 | 15 |
| 2023 | 9 | 8 |
| 2024 | 12 | 7 |
| 2025 | 7 | 7 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Conductive slurry, waterproof pressing structure, circuit membrane and fabrication method thereof16 Dec 2025US 12,501,556 B2Life-On Technology Corporation
- Conductive composite film9 Dec 2025US 12,492,314 B2DDP Specialty Electronic Materials US 9, LLC
- Silicon flexible connectors9 Dec 2025US 12,494,599 B2Northrop Grumman Systems Corporation
- Conductive coating material and circuit former14 Oct 2025US 12,441,896 B2Fujikura Kasei Co., Ltd.
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
- Resin composition, prepreg, resin film, laminate, printed wiring board and semiconductor package2 Jul 2026US 2026/0184870 A1Resonac Corporation
- Sensing device30 Apr 2026US 2026/0122769 A1Honeywell International Inc.
- Method for patterning a self-healing elastomer film, patterned, laser sintered and/or electrical conductivity-improved self-healing film, a multilayer film, an electrical device and use of a programmable laser processing system for patterning a self-healing elastomer film5 Mar 2026US 2026/0061519 A1University of Oulu
- Conductive coating material and circuit former14 Aug 2025US 2025/0257227 A1Fujikura Kasei Co., Ltd.
Most cited
By later US patents
- Stretchable polymer-based electronic device97US 7,337,012 B2Lawrence Livermore National Security, LLC · 2008
- Enhancement of polyimide adhesion on reactive metals96US 5,114,757 A1992
- Method for fabrication of a stretchable electronic skin90US 8,332,053 B1HRL Laboratories, LLC · 2012
- Z-axis compressible polymer with fine metal matrix suspension78US 6,270,363 B1International Business Machines Corporation · 2001
- Stretchable conductor design and methods of making76US 9,554,465 B1Flextronics AP, LLC · 2017