Enhancement of polyimide adhesion on reactive metals
OwnerHarold G. Linde, Rosemary A. Previti-Kellyinventors
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Abstract
In order to improve the adhesion of a polyimide layer to an underlying metal surface, an organic solution which cures to a silsesquioxane copolymer is applied to the surface. The polyimide and the copolymer are formed during a simultaneous curing step.
Claims28
A process for improving the adhesion of a polyimide layer to a metal surface, comprising the steps of:
- applying to said surface an organic solution, prepared by reacting an aminoalkoxysilane monomer, an arylalkoxysilane or arysilazane monomer and water in a solvent;
- heating said surface under such conditions as to form a partially cured layer on said surface;
- applying to said partially cured layer a solution comprising a polyimide precursor material;
- and
- heating said surface under such conditions as to simultaneously form a layer of cured silsesquioxane copolymer, containing reactive amino groups which coordinate to said metal, and which passivates said metal and a polyimide layer.
A process for improving the adhesion of a polyimide layer to a semiconductor substrate containing a pattern of metallization, comprising the steps of:
- applying to said substrate an organic solution, prepared by reacting an aminoalkoxysilane monomer, an arylalkoxysilane or arylsilazane monomer and water in a solvent, wherein said aminoalkoxysilane monomer is represented by the formula:
- ##STR4## wherein:
- R.sub.1 is a hydrogen atom or a saturated hydrocarbon residue or an amino-substituted, saturated hydrocarbon residue, having 2 or 3 carbon atoms;
- R.sub.2 is a saturated hydrocarbon residue having 3 to 6 carbon atoms;
- and
- R.sub.3 is a saturated hydrocarbon residue having 1 to 4 carbon atoms;
- or a mixture thereof;
- said arylalkoxysilane or arylsilazane monomer is represented by the formula, R.sub.4 -Si-(Y).sub.3, wherein R.sub.4 is an unsubstituted or substituted phenyl group and Y is OR.sub.6 or N(R.sub.7).sub.2, wherein R.sub.6 is a saturated hydrocarbon residue having 1 to 4 carbon atoms, and R.sub.7 is a hydrogen atom or a saturated hydrocarbon residue having 1 to 4 carbon atoms;
- and
- said reaction is carried out by employing a mole ratio of arylalkoxysilane monomer to aminoalkoxysilane monomer in the range from about 1:3 to about 4:1, and a mole ratio of water/total monomer in the range from about 0.5:1 to about 2:1;
- heating said substrate at a temperature from about 85.degree. to about 150.degree. C. for a period from about 0.5 to about 20 minutes to form said partially cured layer;
- applying to said partially cured layer a solution comprising a polyimide precursor material;
- and
- heating said substrate at a temperature in excess of 200.degree. C. to form a layer of cured silsesquioxane copolymer, containing reactive amino groups which coordinate to said metal, and which passivates said metal and a polyimide layer.
A cured composite structure, comprising a metal, a polyimide layer, and a layer of silsesquioxane copolymer intermediate said metal and said polyimide layer, said copolymer containing reactive amino groups which coordinate to said metal, and which passivates said metal, said copolymer being employed to improve the adhesion of said polyimide layer to said metal.
A semiconductor structure, comprising a substrate containing a pattern of metallization, a polyimide layer, and a layer of silsesquioxane copolymer intermediate said substrate and said polyimide layer, said copolymer containing reactive amino groups which coordinate to said metal, and which passivates said metal, said copolymer being employed to improve the adhesion of said polyimide layer to said metal.
Dependencies are inferred from the claim text.