Resin composition, prepreg, resin film, laminate, printed wiring board and semiconductor package

Abstract

The present invention provides a resin composition and the like having excellent high-frequency characteristics, while exhibiting high adhesion to conductors and high heat resistance. The resin composition specifically contains a thermosetting resin (A), and a thermoplastic resin (B), in which the thermoplastic resin (B) contains a block copolymer (B1) including a block (b1) that contains a structural unit derived from an aromatic hydrocarbon compound, and a block (b2) that contains a structural unit derived from a conjugated diene compound, the component (B1) does not contain a diblock copolymer, or when the component (B1) contains a diblock copolymer, the content thereof is 50% by mass or less in the component (B1), and the weight-average molecular weight of the component (B1) is 130,000 or less.

Dependencies are inferred from the claim text.