Back to results
US 12,501,556 B2Granted
Conductive slurry, waterproof pressing structure, circuit membrane and fabrication method thereof
AssigneeLife-On Technology Corporation
InventorJen-Chieh Huang
Life of this patent
Estimating the term…
Abstract
The disclosure provides a conductive slurry, which includes a conductive paste comprising polar materials and a hydrophobic agent mixed with the conductive paste. The hydrophobic agent includes solvent and hydrophobic particles. The solvent of the hydrophobic agent includes a non-polar material.
Claims20
A conductive slurry, comprising:
- a conductive paste comprising polar materials;
- and
- a hydrophobic agent mixed with the conductive paste and comprising solvent and hydrophobic particles, wherein the solvent of the hydrophobic agent comprises a non-polar material.
A circuit membrane, comprising:
- a membrane;
- and
- a wiring structure located on the membrane, wherein the wiring structure comprises a conductive material and a hydrophobic material, wherein a concentration of the hydrophobic material contained in a first portion of the wiring structure is greater than a concentration of the hydrophobic material contained in a second portion of the wiring structure, and the second portion is located between the first portion and the membrane.
A fabrication method of a circuit membrane, comprising:
- applying a conductive slurry on a membrane to form a patterned layer, wherein the conductive slurry comprises a conductive paste and a hydrophobic agent mixed with the conductive paste, and wherein the hydrophobic agent comprises solvent and hydrophobic particles;
- and
- performing a volatilization process to form a wiring structure, wherein at least a portion of the hydrophobic particles inside the patterned layer are transferred to a surface of the patterned layer during the volatilization process.
A waterproof pressing structure, comprising:
- a first membrane;
- a first wiring structure having at least one first contact located on the first membrane, wherein the first wiring structure comprises a conductive material and hydrophobic particles, wherein the first wiring structure has a water contact angle of or greater than about 120°;
- a second membrane;
- a second wiring structure having at least one second contact located on the second membrane;
- and
- an insulation layer disposed between the first membrane and the second membrane, wherein the insulation layer has an opening, and the at least one first contact overlaps the at least one second contact corresponding to the opening.
3 more elements
Dependencies are inferred from the claim text.