H05K 2201/0179
Thin film deposited insulating layer
Official title: Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
H05K2201/0179 (Thin film deposited insulating layer) appears on 273 US grants and 321 published applications in this corpus.
Search patents in H05K- Granted patents
- 273
- Published applications
- 321
- Assignees
- 171
- Inventors
- 691
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 5 | 0 |
| 2001 | 7 | 5 |
| 2002 | 13 | 18 |
| 2003 | 12 | 11 |
| 2004 | 7 | 12 |
| 2005 | 11 | 12 |
| 2006 | 7 | 35 |
| 2007 | 11 | 43 |
| 2008 | 20 | 31 |
| 2009 | 18 | 33 |
| 2010 | 18 | 17 |
| 2011 | 22 | 16 |
| 2012 | 14 | 7 |
| 2013 | 12 | 2 |
| 2014 | 6 | 6 |
| 2015 | 7 | 8 |
| 2016 | 3 | 3 |
| 2017 | 5 | 9 |
| 2018 | 6 | 7 |
| 2019 | 8 | 8 |
| 2020 | 7 | 7 |
| 2021 | 4 | 8 |
| 2022 | 7 | 4 |
| 2023 | 4 | 4 |
| 2024 | 6 | 9 |
| 2025 | 2 | 5 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board3 Mar 2026US 12,568,574 B2Panasonic Intellectual Property Management Co., Ltd.
- Protective coating13 Jan 2026US 12,521,756 B2
- Backplane and glass-based circuit board13 Jan 2026US 12,525,568 B2Beijing Boe Display Technology Co., Ltd.
- Immersion cooling with water-based fluid using nano-structured coating23 Sep 2025US 12,426,206 B2The Board of Trustees of the University of Illinois
- Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor13 May 2025US 12,297,354 B2Mitsui Mining & Smelting Co., Ltd.
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
- Copper/ceramic bonded body and insulated circuit board27 Nov 2025US 2025/0365859 A1Mitsubishi Materials Corporation
- Light emitting diode (led) for optical efficiency8 May 2025US 2025/0151501 A1Pure Impact Fzco
- Printed circuit board17 Apr 2025US 2025/0126715 A1Samsung Electro-Mechanics Co., Ltd.
- Electroless seed layer deposition on glass core substrates27 Mar 2025US 2025/0106997 A1Intel Corporation
Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards138US 5,027,253 AIBM Corporation · 1991
- Multilayer substrate112US 7,297,627 B2Medtronic MiniMed, Inc. · 2007
- Process and device for hermetic encapsulation of electronic components98US 5,461,545 AThomson-CSF · 1995