Immersion cooling with water-based fluid using nano-structured coating

A cooling system comprising:

• a central cooling line that circulates a water-based fluid in a loop to cool mechanical and electrical components of a machine;
• an injector coupled to the central cooling line and adapted to force the water-based fluid past printed circuit boards (PCBs) on which are disposed one or more high-thermal electrical components;
• an output coupled to the central cooling line to recycle vapor and residual water-based fluid exiting the PCBs;
• and
• a nano-engineered coating that covers an outside and top portion of the one or more high-thermal electrical components, wherein the nano-engineered coating comprises:
• an electrical insulation coating of between two to 25 microns in thickness deposited on the one or more high-thermal electrical components;
• and
• a metallic nano-layer comprising a porous metallic nano-structure deposited on the electrical insulation coating.

An apparatus comprising:

• a printed circuit board (PCB) having one or more power electronic components disposed on the PCB;
• an electrical insulation coating that covers an outside and top portion of the one or more power electronic components relative to the PCB, wherein the electrical insulation coating is between two to 25 microns thick;
• and
• a nano-layer comprising a porous metal-based nano-structure and that is deposited on the electrical insulation coating, wherein the nano-layer is a super-hydrophilic nucleating coating and is configured to be.