Electroless seed layer deposition on glass core substrates

Abstract

Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, and a liner with a first surface is on a sidewall of the opening and a second surface is facing away from the sidewall of the opening. In an embodiment, the liner comprises a matrix, and filler particles in the matrix. In an embodiment, a plurality of cavities are provided into the second surface of the liner. In an embodiment, a via is in the opening, where the via is electrically conductive.

Dependencies are inferred from the claim text.