Process and device for hermetic encapsulation of electronic components
AssigneeThomson-CSF
InventorsMichel Leroy, Christian Val
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Abstract
According to an embodiment of the invention the discrete or integrated electronic components are encapsulated, each in a package, for example a plastic one; the packages are then mounted on a printed circuit board, for example an epoxy one. The components and board as a whole are covered with a relatively thick first layer consisting of an organic compound and ensuring a levelling function, followed by a second layer such as an inorganic metal compound, the function of which is to ensure the hermetic sealing of the whole.
Claims12
Device for hermetic encapsulation of electronic components, comprising
- packages enclosing electronic components,
- a printed circuit board on which the packages are mechanically mounted and electrically connected,
- a first layer of a deposited organic material covering the whole of the board and the packages except where needed to make contacts;
- a second layer of a deposited hermetic inorganic material covering the first layer.
A hermetic encapsulation of at least one electronic component, comprising
- an electronic component,
- a first layer on the component, said first layer being made of a deposited organic material and of a thickness and having an outer surface shape smoother than the surface shape of the component, and
- a second layer on the first layer, said second layer being made of a deposited hermetic inorganic material.
Dependencies are inferred from the claim text.