H05K 2201/0175
Inorganic, non-metallic layer
Official title: Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor
H05K2201/0175 (Inorganic, non-metallic layer) appears on 321 US grants and 389 published applications in this corpus.
Search patents in H05K- Granted patents
- 321
- Published applications
- 389
- Assignees
- 181
- Inventors
- 794
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 4 | 0 |
| 1999 | 6 | 0 |
| 2000 | 4 | 0 |
| 2001 | 6 | 2 |
| 2002 | 10 | 21 |
| 2003 | 11 | 6 |
| 2004 | 6 | 5 |
| 2005 | 6 | 12 |
| 2006 | 8 | 25 |
| 2007 | 7 | 40 |
| 2008 | 12 | 34 |
| 2009 | 19 | 32 |
| 2010 | 25 | 23 |
| 2011 | 14 | 12 |
| 2012 | 15 | 12 |
| 2013 | 15 | 10 |
| 2014 | 14 | 10 |
| 2015 | 8 | 21 |
| 2016 | 12 | 5 |
| 2017 | 8 | 11 |
| 2018 | 8 | 12 |
| 2019 | 20 | 18 |
| 2020 | 10 | 11 |
| 2021 | 11 | 15 |
| 2022 | 12 | 11 |
| 2023 | 8 | 12 |
| 2024 | 10 | 12 |
| 2025 | 7 | 10 |
| 2026 | 8 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Wiring board22 Sep 2026US 12,745,348 B2KYOCERA Corporation
- Method of manufacturing a formed film14 Apr 2026US 12,604,397 B2Canatu Oy
- Heat transfer from non-groundable electronic components31 Mar 2026US 12,593,394 B2Skyworks Solutions, Inc.
- Multilayer substrate and method of manufacturing multilayer substrate24 Feb 2026US 12,563,677 B2Murata Manufacturing Co., Ltd.
- Substrate structure and power supply device3 Sep 2026US 2026/0262158 A1TDK Corporation
- Programmable circuit board and method of use20 Aug 2026US 2026/0247527 A1Itera, Inc.
- Transfer of heat from non-groundable electronic components2 Jul 2026US 2026/0190212 A1Skyworks Solutions, Inc.
- Printed circuit board7 May 2026US 2026/0129747 A1Samsung Electro-Mechanics Co., Ltd.
- Package substrate and fabricating method thereof26 Feb 2026US 2026/0059658 A1AaltoSemi Inc.
Most cited
By later US patents
- Flexible interconnect film including resistor and capacitor layers289US 5,874,770 AGeneral Electric Company · 1999
- Sensor substrate and method of fabricating same207US 7,323,142 B2Medtronic MiniMed, Inc. · 2008
- Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements205US 5,757,074 AHughes Electronics Corporation · 1998
- Illumination system148US 7,165,863 B12007
- Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards138US 5,027,253 AIBM Corporation · 1991