Heat transfer from non-groundable electronic components

An electronic device, comprising:

• a circuit board configured to receive one or more electronic packages;
• and
• an electronic package mounted to the circuit board, the electronic package including a substrate, at least one ground plane enclosed in or supported by the substrate, at least one electronic component mounted to the substrate, the at least one electronic component including at least one non-groundable thermal output, at least one thermally conductive pathway extending within the substrate between an interface exposed on the substrate and the at least one ground plane, the at least one thermally conductive pathway configured to electrically isolate the interface from the at least one ground plane, and at least one thermally conductive member coupling the output to the interface, the at least one thermally conductive pathway including at least one portion of thermally conductive, electrically insulative material encapsulated within the substrate, a metallic layer being defined on an exposed region of the at least one portion of thermally conductive, electrically insulative material, the metallic layer defining the interface.