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US 2026/0059658 A1Published application
Package substrate and fabricating method thereof
AssigneeAaltoSemi Inc.
InventorsAndrew C. CHANG, Min-Yao CHEN, Yin-Ju CHEN
Life of this patent
Estimating the term…
Abstract
Provided are a package substrate and a method for fabricating the package substrate. The method is to form a wiring structure on a circuit structure having a core layer. The circuit structure is served as a ball-attach side to reduce the number of layers of the package substrate. Accordingly, the overall thickness of the package substrate is advantageously reduced.
Claims26
A package substrate, comprising:
- a circuit structure including a core layer and a circuit layer formed on each of two opposite surfaces of the core layer, wherein the core layer has conductive pillars electrically connected to the circuit layers, one side of the circuit structure is served as a ball-attach side, the other side of the circuit structure is served as a build-up side, and the circuit layer on the ball-attach side has a plurality of electrical contact pads;
- and
- a wiring structure disposed on the build-up side of the circuit structure and electrically connected to the circuit layer on the build-up side of the circuit structure.
A method of fabricating a package substrate, comprising:
- providing a plurality of circuit structures, wherein each of the plurality of circuit structures includes a core layer and a circuit layer formed on each of two opposite surfaces of the core layer, the core layer has conductive pillars electrically connected to the circuit layers, one side of each of the plurality of circuit structures is served as a ball-attach side, the other side of each of the plurality of circuit structures is served as a build-up side, and the circuit layer on the ball-attach side has a plurality of electrical contact pads;
- bonding the ball-attach side of each of the plurality of circuit structures to two opposite sides of a carrier;
- forming a wiring structure on the build-up side of each of the plurality of circuit structures, wherein the wiring structure is electrically connected to the circuit layer on the build-up side of each of the plurality of circuit structures;
- and
- removing the carrier.
2 more elements
A package substrate, comprising:
- a circuit structure including:
- a core layer having a plurality of through-holes connecting two opposite surfaces of the core layer;
- a bonding layer formed on the two opposite surfaces of the core layer and on wall surfaces of the plurality of through-holes;
- an insulating layer formed on the bonding layer and having a plurality of vias corresponding to the plurality of through-holes;
- conductive pillars formed in the plurality of vias, respectively;
- and
- a circuit layer formed on the insulating layer on each of the two opposite surfaces of the core layer and electrically connected to the conductive pillars, wherein one side of the circuit structure is served as a ball-attach side, the other side of the circuit structure is served as a build-up side, and the circuit layer on the ball-attach side has a plurality of electrical contact pads;
- and
- a wiring structure disposed on the build-up side of the circuit structure and electrically connected to the circuit layer on the build-up side of the circuit structure, wherein an outermost side of the wiring structure has a plurality of electrical contact pads, and a width of each of the plurality of electrical contact pads on the outermost side of the wiring structure is less than a width of each of the plurality of electrical contact pads of the circuit layer.
6 more elements
Dependencies are inferred from the claim text.