Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements

A microwave/millimeter wave circuit structure comprising:

• a non-ceramic and non-semiconductor dielectric substrate,
• an electrical interconnection network on said substrate, and
• a plurality of discrete circuit elements, each of said plurality of discrete circuit elements being flip-chip mounted to said substrate with bumps including solder that electrically contact and mechanically adhere to and align with said interconnection network so that said discrete circuit elements are electrically interconnected by said interconnection network, with spacings between the interconnected circuit elements compatible with electrical signals with wavelengths in at least part of the microwave/millimeter range, wherein said dielectric substrate is less than approximately 600 micrometers thick, further comprising a stiffening substrate adhered to said dielectric substrate.

A microwave/millimeter wave circuit structure comprising:

• a non-ceramic and non-semiconductor dielectric substrate,
• an electrical interconnection network on said substrate, and
• a plurality of discrete circuit elements, each of said plurality of discrete circuit elements being flip-chip mounted to said substrate with bumps including solder that electrically contact and mechanically adhere to and align with said interconnection network so that said discrete circuit elements are electrically interconnected by said interconnection network, with spacings between the interconnected circuit elements compatible with electrical signals with wavelengths in at least part of the microwave/millimeter range, wherein said substrate is formed from a low-loss plastic material.