H05K 2201/0166
Polymeric layer used for special processing
Official title: Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
H05K2201/0166 (Polymeric layer used for special processing) appears on 164 US grants and 110 published applications in this corpus.
Search patents in H05K- Granted patents
- 164
- Published applications
- 110
- Assignees
- 106
- Inventors
- 436
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 9 | 0 |
| 1994 | 4 | 0 |
| 1995 | 5 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 8 | 0 |
| 1999 | 6 | 0 |
| 2000 | 6 | 0 |
| 2001 | 9 | 1 |
| 2002 | 3 | 13 |
| 2003 | 6 | 2 |
| 2004 | 4 | 3 |
| 2005 | 2 | 8 |
| 2006 | 4 | 8 |
| 2007 | 7 | 7 |
| 2008 | 2 | 6 |
| 2009 | 2 | 3 |
| 2010 | 2 | 8 |
| 2011 | 4 | 4 |
| 2012 | 6 | 3 |
| 2013 | 0 | 0 |
| 2014 | 3 | 3 |
| 2015 | 0 | 4 |
| 2016 | 2 | 3 |
| 2017 | 3 | 4 |
| 2018 | 3 | 4 |
| 2019 | 3 | 2 |
| 2020 | 2 | 6 |
| 2021 | 3 | 1 |
| 2022 | 2 | 2 |
| 2023 | 1 | 5 |
| 2024 | 5 | 2 |
| 2025 | 1 | 3 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board21 Apr 2026US 12,606,662 B2Resonac Corporation
- Printed circuit board and semiconductor package which include multi-layered photosensitive insulating layer30 Sep 2025US 12,431,463 B2Samsung Electronics Co., Ltd.
- Electronic component embedded substrate8 Oct 2024US 12,114,428 B2Samsung Electro-Mechanics Co., Ltd.
- Substrate for pattern formation13 Feb 2024US 11,898,008 B2Daikin Industries, Ltd.
- Structure for embedding and packaging multiple devices by layer and method for manufacturing same13 Feb 2024US 11,903,133 B2Zhuhai ACCESS Semiconductor Co., Ltd.
- Ball grid array package24 Sep 2026US 2026/0292989 A1LG Innotek Co., Ltd.
- Curable composition and insulating film11 Jun 2026US 2026/0159638 A1Dupont Electronics, Inc.
- Protection circuit module, method of manufacturing same and secondary battery including same26 Mar 2026US 2026/0088606 A1Samsung SDI.Co., Ltd.
- Package substrate and fabricating method thereof26 Feb 2026US 2026/0059658 A1AaltoSemi Inc.
- Method of manufacturing a semiconductor package and printed circuit board1 Jan 2026US 2026/0005196 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Methods of forming channels and vias in insulating layers187US 5,173,442 AMicroelectronics and Computer Technology Corporation · 1992
- Forming via holes in a multilevel substrate in a single step139US 5,227,013 AMicroelectronics and Computer Technology Corporation · 1993
- Trenching techniques for forming channels, vias and components in substrates116US 5,219,787 AMicroelectronics and Computer Technology Corporation · 1993
- Trenching techniques for forming vias and channels in multilayer electrical interconnects113US 5,091,339 AMicroelectronics and Computer Technology Corporation · 1992
- Multi-layer double-sided wiring board and method of fabricating the same113US 6,803,528 B13M Innovative Properties Company · 2004