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US 2026/0292989 A1Published application
Ball grid array package
AssigneeLG Innotek Co., Ltd.
InventorsSeong Su EOM, Jee Hee LIM, Jun Phill EOM, Hee Jung LEE, Do Youb KWON
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AssigneeLG Innotek Co., Ltd.
InventorsSeong Su EOM, Jee Hee LIM, Jun Phill EOM, Hee Jung LEE, Do Youb KWON
Estimating the term…
A ball grid array package according to an embodiment of the present invention comprises: a first circuit board; a second circuit board disposed above the first circuit board; a first solder ball and a second solder ball disposed between the first circuit board and the second circuit board so as to be spaced apart from each other; a first adhesive disposed between the first circuit board and the second circuit board so as to extend from the upper surface of the first circuit board to the lower surface of the second circuit board along a first side surface of the first solder ball; and a second adhesive disposed between the first circuit board and the second circuit board so as to extend from the upper surface of the first circuit board to the lower surface of the second circuit board along a second side surface of the second solder ball. The first side surface of the first solder ball and the second side surface of the second solder ball are disposed to face each other. The first adhesive and the second adhesive form a channel area between the first circuit board and the second circuit board. The area of the channel area corresponds to 30-70% of the area of spacing between the first side surface of the first solder ball and the second side surface of the second solder ball.
-10. (canceled)
A ball grid array package comprising:
A ball grid array package comprising:
Dependencies are inferred from the claim text.