Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board

A photosensitive resin composition comprising:

• (A) a photopolymerizable compound having an ethylenically unsaturated group;
• (X) organic particles;
• and
• (B) a photopolymerization initiator, wherein
• the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group,
• the organic particles (X) contain core-shell particles, and
• a combination (core/shell) of a component constituting cores of the core-shell particles and a component constituting shells thereof is styrene-butadiene copolymer/(meth)acrylic acid ester copolymer, (meth)acrylic acid ester copolymer/epoxy resin, epoxy resin/silicone rubber, acrylonitrile-butadiene copolymer/(meth)acrylic acid ester copolymer, polyethylene/(meth)acrylic acid ester copolymer, polybutadiene/(meth)acrylic acid ester copolymer, or polyester/(meth)acrylic acid ester copolymer.