Electronic component embedded substrate
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYun Je Ji, Yong Hoon Kim, Seung Eun Lee
Life of this patent
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Abstract
An electronic component embedded substrate includes: an insulating material including a cavity formed in one surface thereof; a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity; solders disposed on side surfaces of the cavity; and an electronic component disposed in the cavity and at least partially in contact with the solders, wherein the protective layer has a material different from that of the insulating material.
Claims20
An electronic component embedded substrate comprising:
- an insulating material including a cavity disposed in one surface thereof;
- a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity;
- solders disposed on side surfaces of the cavity;
- and
- an electronic component disposed in the cavity and at least partially in contact with the solders,
- wherein the protective layer has a material different from that of the insulating material, and
- wherein the protective layer includes an insulative material.
An electronic component embedded substrate comprising:
- an insulating material including a cavity disposed in one surface thereof;
- a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity;
- solders disposed on side surfaces of the cavity;
- a first circuit layer disposed on one surface of the insulating material;
- a second circuit layer embedded in the insulating material;
- vias connecting the first and second circuit layers to each other;
- and
- an electronic component disposed in the cavity and at least partially in contact with the solders,
- wherein the protective layer has a material different from that of the insulating material, and
- wherein the vias are eccentric toward the cavity of the insulating material.
An electronic component embedded substrate comprising:
- an insulating material including a cavity disposed in one surface thereof;
- a protective layer embedded in the insulating material and covering an entire bottom surface of the cavity;
- solders disposed on side surfaces of the cavity;
- a first circuit layer disposed on one surface of the insulating material;
- a second circuit layer embedded in the insulating material;
- vias connecting the first and second circuit layers to each other;
- and
- an electronic component disposed in the cavity and at least partially in contact with the solders,
- wherein the protective layer has a material different from that of the insulating material, and
- wherein at least a portion of each of the first and second circuit layers and the vias extend from at least one of the side surfaces of the cavity of the insulating material.
Dependencies are inferred from the claim text.