Printed circuit board and semiconductor package which include multi-layered photosensitive insulating layer
AssigneeSamsung Electronics Co., Ltd.
InventorHyejin Kim
Life of this patent
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Abstract
A printed circuit board may include a substrate body portion, conductive patterns on a top surface of the substrate body portion, and a photosensitive insulating layer on the top surface of the substrate body portion and including an opening exposing at least one of the conductive patterns. The photosensitive insulating layer includes first to third sub-layers stacked sequentially. The first sub-layer includes an amine compound or an amide compound. A refractive index of the second sub-layer is lower than a refractive index of the third sub-layer. A photosensitizer content of the second sub-layer is higher than a photosensitizer content of the third sub-layer.
Claims20
A printed circuit board comprising:
- a substrate body portion;
- conductive patterns on a top surface of the substrate body portion;
- and
- a photosensitive insulating layer on the top surface of the substrate body portion and comprising an opening exposing a first one of the conductive patterns,
- wherein the photosensitive insulating layer comprises a first sub-layer, a second sub-layer and a third sub-layer which are stacked sequentially on the top surface of the substrate body portion,
- wherein the first sub-layer includes an amine compound or an amide compound,
- wherein a refractive index of the second sub-layer is lower than a refractive index of the third sub-layer, and
- wherein a photosensitizer content of the second sub-layer is higher than a photosensitizer content of the third sub-layer.
A semiconductor package comprising:
- a first redistribution substrate;
- a semiconductor device on the first redistribution substrate;
- a mold layer on the semiconductor device and the first redistribution substrate;
- a second redistribution substrate on the mold layer;
- a signal via in the mold layer, the signal via connecting the first redistribution substrate and the second redistribution substrate and being configured to transmit an electrical signal;
- a power via connecting the first redistribution substrate and the second redistribution substrate, the power via being configured to transmit a power voltage;
- and
- connection terminals contacting a bottom surface of the first redistribution substrate,
- wherein the first redistribution substrate comprises a first photosensitive insulating layer and a second photosensitive insulating layer which are stacked sequentially,
- wherein the first photosensitive insulating layer comprises a first sub-layer, a second sub-layer and a third sub-layer which are stacked sequentially,
- wherein the first sub-layer includes an amine compound or an amide compound,
- wherein a refractive index of the second sub-layer is lower than a refractive index of the third sub-layer, and
- wherein a photosensitizer content of the second sub-layer is higher than a photosensitizer content of the third sub-layer.
A semiconductor package comprising:
- a substrate;
- and
- a semiconductor device mounted on the substrate,
- wherein the substrate comprises:
- a substrate body portion;
- conductive patterns on a top surface of the substrate body portion;
- and
- a photosensitive insulating layer on the top surface of the substrate body portion and comprising an opening exposing a first one of the conductive patterns,
- wherein the photosensitive insulating layer comprises a first sub-layer, a second sub-layer, a third sub-layer and a fourth sub-layer which are stacked sequentially,
- wherein the first sub-layer includes an amine compound or an amide compound,
- wherein a refractive index of the second sub-layer is lower than refractive indexes of the third and fourth sub-layers, and
- wherein a photosensitizer content of the third sub-layer is higher than a photosensitizer content of the fourth sub-layer.
Dependencies are inferred from the claim text.