H05K 2201/0104
Properties and characteristics in general
H05K2201/0104 (Properties and characteristics in general) appears on 3,410 US grants and 3,523 published applications in this corpus.
Search patents in H05K- Granted patents
- 3,410
- Published applications
- 3,523
- Assignees
- 1,352
- Inventors
- 7,871
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 6 | 0 |
| 1978 | 16 | 0 |
| 1979 | 8 | 0 |
| 1980 | 12 | 0 |
| 1981 | 11 | 0 |
| 1982 | 15 | 0 |
| 1983 | 19 | 0 |
| 1984 | 16 | 0 |
| 1985 | 16 | 0 |
| 1986 | 15 | 0 |
| 1987 | 22 | 0 |
| 1988 | 24 | 0 |
| 1989 | 39 | 0 |
| 1990 | 29 | 0 |
| 1991 | 29 | 0 |
| 1992 | 40 | 0 |
| 1993 | 35 | 0 |
| 1994 | 42 | 0 |
| 1995 | 37 | 0 |
| 1996 | 46 | 0 |
| 1997 | 41 | 0 |
| 1998 | 62 | 0 |
| 1999 | 74 | 0 |
| 2000 | 66 | 0 |
| 2001 | 83 | 34 |
| 2002 | 76 | 88 |
| 2003 | 101 | 130 |
| 2004 | 87 | 136 |
| 2005 | 64 | 136 |
| 2006 | 77 | 116 |
| 2007 | 73 | 110 |
| 2008 | 67 | 174 |
| 2009 | 83 | 194 |
| 2010 | 79 | 142 |
| 2011 | 87 | 104 |
| 2012 | 121 | 107 |
| 2013 | 90 | 111 |
| 2014 | 84 | 184 |
| 2015 | 102 | 192 |
| 2016 | 137 | 204 |
| 2017 | 158 | 176 |
| 2018 | 161 | 207 |
| 2019 | 195 | 172 |
| 2020 | 162 | 190 |
| 2021 | 152 | 152 |
| 2022 | 133 | 127 |
| 2023 | 83 | 109 |
| 2024 | 111 | 85 |
| 2025 | 70 | 85 |
| 2026 | 45 | 58 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 2201/0133Elastomeric or compliant polymerIndexing code1,000
- H05K 2201/0129Thermoplastic polymerIndexing code882
- H05K 2201/0108TransparentIndexing code769
- H05K 2201/0116PorousIndexing code402
- H05K 2201/012Flame-retardantIndexing code353
- H05K 2201/0112Absorbing lightIndexing code150
- H05K 2201/0125ShrinkableIndexing code44
Recent patents
- Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness8 Sep 2026US 12,733,110 B2Iee International Electronics & Engineering S.A.
- Transparent article with electrically-conductive pattern1 Sep 2026US 12,727,092 B2Eastman Kodak Company
- Photosensitive resin composition, transfer film, cured film, laminate, and method for manufacturing touch panel25 Aug 2026US 12,717,230 B2FUJIFILM Corporation
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Method and system for transfer printing of films25 Aug 2026US 12,720,685 B2University of Virginia Patent Foundation
- Flexible and stretchable structures8 Oct 2026US 2026/0313807 A1Liquid Wire Inc.
- Transparent article with electrically-conductive pattern8 Oct 2026US 2026/0313810 A1Eastman Kodak Company
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
Most cited
By later US patents
- Flex circuit connector916US 5,482,473 AMiniMed Inc. · 1996
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997