H05K 2201/0116
Porous
Official title: Porous, e.g. foam
H05K2201/0116 (Porous) appears on 402 US grants and 359 published applications in this corpus.
Search patents in H05K- Granted patents
- 402
- Published applications
- 359
- Assignees
- 251
- Inventors
- 1,043
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 5 | 0 |
| 1988 | 7 | 0 |
| 1989 | 6 | 0 |
| 1990 | 9 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 7 | 0 |
| 1994 | 6 | 0 |
| 1995 | 8 | 0 |
| 1996 | 11 | 0 |
| 1997 | 15 | 0 |
| 1998 | 23 | 0 |
| 1999 | 9 | 0 |
| 2000 | 13 | 0 |
| 2001 | 10 | 7 |
| 2002 | 13 | 17 |
| 2003 | 18 | 18 |
| 2004 | 17 | 27 |
| 2005 | 8 | 14 |
| 2006 | 13 | 21 |
| 2007 | 12 | 19 |
| 2008 | 6 | 19 |
| 2009 | 11 | 21 |
| 2010 | 9 | 16 |
| 2011 | 8 | 18 |
| 2012 | 19 | 14 |
| 2013 | 16 | 12 |
| 2014 | 6 | 8 |
| 2015 | 5 | 13 |
| 2016 | 11 | 10 |
| 2017 | 11 | 11 |
| 2018 | 10 | 16 |
| 2019 | 8 | 12 |
| 2020 | 9 | 12 |
| 2021 | 12 | 12 |
| 2022 | 11 | 14 |
| 2023 | 4 | 15 |
| 2024 | 4 | 5 |
| 2025 | 6 | 4 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Display apparatus19 May 2026US 12,632,081 B2LG Display Co., Ltd.
- Printed circuit board and preparation method thereof, and electronic communication device19 May 2026US 12,635,068 B2Huawei Technologies Co., Ltd.
- Wiring board7 Apr 2026US 12,598,700 B2KYOCERA Corporation
- Porous liquid crystal polymer sheet, metal layer-attached porous liquid crystal polymer sheet, and electronic circuit board23 Dec 2025US 12,503,649 B2Murata Manufacturing Co., Ltd.
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Copper-clad laminate having low dielectric constant, low dielectric loss and high thermal conductivity and method for manufacturing the same23 Apr 2026US 2026/0113853 A1CRHM Co., Ltd.
- Inlay With Exposed Porous Layer, Component Carrier, and Manufacturing Method19 Mar 2026US 2026/0082487 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Module and method for manufacturing module28 Aug 2025US 2025/0273602 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Porous polymeric membrane toughened composites189US 6,737,158 B1Gore Enterprise Holdings, Inc. · 2004
- Porous substrate and conductive ink filled vias for printed circuits181US 5,346,750 AMatsushita Electric Industrial Co., Ltd. · 1994
- Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same153US 5,484,647 AMatsushita Electric Industrial Co., Ltd. · 1996
- Strip line cable using a porous, crystalline polymer dielectric tape131US 4,382,236 AJunkosha Inc. · 1983
- Method of manufacturing organic substrate used for printed circuits112US 5,481,795 AMatsushita Electric Industrial Co., Ltd. · 1996