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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsSeiichi Nakatani, Akihito Hatakeyama, Kouji Kawakita, Hirishi Sogou, Tatsuo Ogawa, Tamao Kojima
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A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree-films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
A connecting member of a circuit substrate comprising an organic porous base material provided with tackfree films on both sides, wherein said connecting member of a circuit substrate has through-holes, and said through-holes are filled with conductive resin compound up to the outer surface of said tackfree films, wherein said through-holes filled with the conductive resin compound have a diameter of 50 .mu.m to 1 mm and said through-holes filled with the conductive resin compound have a pitch of 50 .mu.m or more.
Dependencies are inferred from the claim text.