Module and method for manufacturing module

Abstract

A module, including: a sealed body including a circuit board and an electronic component each sealed with a sealing resin, wherein a conductor is exposed from a part of a surface of the sealed body; and a rewiring layer disposed on a surface of the sealed body and including an insulating layer and a rewiring conductor connected to the conductor, wherein the rewiring conductor includes: a connecting conductor disposed in the insulating layer and connected to the conductor; and an input/output electrode disposed on a surface of the insulating layer on a side opposite to a side facing the sealed body and connected to the connecting conductor, and the rewiring conductor and the insulating layer include first pores and second pores, respectively, each of the first pores having a smaller average diameter than each of the second pores in the insulating layer.

Dependencies are inferred from the claim text.