Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate

A multilayer substrate comprising:

• a multilayer body including a plurality of insulation layers stacked on top of one another in an up-and-down direction, the plurality of insulation layers including a porous insulation layer;
• wherein
• the multilayer substrate includes a first region and a second region;
• a dimension of the porous insulation layer in the up-and-down direction is smaller in the first region than in the second region;
• at least one of an average void size of the porous insulation layer is smaller in the first region than in the second region, or the porous insulation layer is denser in the first region than in the second region;
• the porous insulation layer is a closed-cell foam in which major voids are discrete bubbles that are entirely surrounded with a material of the porous insulation layer;
• at least one of an average void size of the voids is smaller in the first region than in the second region, or the voids are configured in the porous insulation layer such that the porous insulation layer is denser in the first region than in the second region;
• the multilayer substrate includes a first section and a second section;
• the first section is curved;
• and
• the first section is located in the first region.