H05K 2201/0108
Transparent
H05K2201/0108 (Transparent) appears on 769 US grants and 985 published applications in this corpus.
Search patents in H05K- Granted patents
- 769
- Published applications
- 985
- Assignees
- 478
- Inventors
- 2,138
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 6 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 5 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 8 | 0 |
| 2002 | 11 | 9 |
| 2003 | 9 | 10 |
| 2004 | 5 | 14 |
| 2005 | 4 | 16 |
| 2006 | 9 | 16 |
| 2007 | 3 | 22 |
| 2008 | 10 | 36 |
| 2009 | 17 | 44 |
| 2010 | 11 | 33 |
| 2011 | 24 | 23 |
| 2012 | 24 | 29 |
| 2013 | 15 | 45 |
| 2014 | 25 | 102 |
| 2015 | 47 | 105 |
| 2016 | 70 | 80 |
| 2017 | 78 | 67 |
| 2018 | 52 | 57 |
| 2019 | 57 | 52 |
| 2020 | 56 | 47 |
| 2021 | 48 | 42 |
| 2022 | 34 | 38 |
| 2023 | 20 | 30 |
| 2024 | 32 | 31 |
| 2025 | 22 | 28 |
| 2026 | 17 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Transparent article with electrically-conductive pattern1 Sep 2026US 12,727,092 B2Eastman Kodak Company
- Photosensitive resin composition, transfer film, cured film, laminate, and method for manufacturing touch panel25 Aug 2026US 12,717,230 B2FUJIFILM Corporation
- Silver nanowire thin-film patterning method25 Aug 2026US 12,721,113 B2Seoul National University R&Db Foundation
- Single-layer printed circuit board for a lighting device18 Aug 2026US 12,710,144 B2Lutron Technology Company LLC
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Transparent article with electrically-conductive pattern8 Oct 2026US 2026/0313810 A1Eastman Kodak Company
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Wiring board, module, and image display apparatus27 Aug 2026US 2026/0254102 A1Dai Nippon Printing Co.Ltd.
- Wiring board and method for manufacturing wiring board13 Aug 2026US 2026/0239527 A1Dai Nippon Printing Co.Ltd.
- Multilayer wiring substrate9 Jul 2026US 2026/0198161 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Method of manufacturing a thin-film pattern on a substrate253US 5,259,926 AHitachi, Ltd. · 1993
- Rearview mirror element having a circuit mounted to the rear surface of the element219US 7,706,046 B2Gentex Corporation · 2010
- Methods of forming two-sided HDMI interconnect structures88US 5,691,245 AHE Holdings, Inc. · 1997
- Attachment method for assembly of high density multiple interconnect structures88US 5,998,291 ARaytheon Company · 1999
- L.E.D Lighting unit with transparent carrier panel85US 6,270,236 B1Siemens Aktiengesellschaft · 2001