Multilayer wiring substrate

A multilayer wiring substrate comprising:

• a substrate having transparency and light transmission;
• and
• a first conductor pattern and a second conductor pattern arranged at different positions from each other in a thickness direction of the substrate,
• the first conductor pattern being made of multiple first conductive lines that have been thinned,
• the second conductor pattern being made of multiple second conductive lines that have been thinned,
• the first conductor pattern and the second conductor pattern being provided with an overlapping pattern where the first conductor pattern and the second conductor pattern partially overlap with each other in the thickness direction of the substrate,
• in the overlapping pattern, the multiple first conductive lines and the multiple second conductive lines intersecting with each other in a plan view,
• the overlapping pattern including at least one connection region where the multiple first conductive lines and the multiple second conductive lines are electrically connected to each other,
• the second conductive lines located in the at least one connection region each having at least one via portion,
• at an intersection at which one of the multiple first conductive lines and one of the multiple second conductive lines intersect with each other in the at least one connection region, the at least one via portion being formed to be electrically connected to the one of the multiple first conductive lines,
• the at least one via portion having a line width equal to or lower than a line width of the one of the multiple second conductive lines.