H05K 2201/0112
Absorbing light
Official title: Absorbing light, e.g. dielectric layer with carbon filler for laser processing
H05K2201/0112 (Absorbing light) appears on 150 US grants and 136 published applications in this corpus.
Search patents in H05K- Granted patents
- 150
- Published applications
- 136
- Assignees
- 112
- Inventors
- 413
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 5 | 0 |
| 1980 | 4 | 0 |
| 1981 | 3 | 0 |
| 1982 | 4 | 0 |
| 1983 | 6 | 0 |
| 1984 | 5 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 6 | 9 |
| 2003 | 4 | 5 |
| 2004 | 10 | 9 |
| 2005 | 3 | 11 |
| 2006 | 5 | 6 |
| 2007 | 0 | 4 |
| 2008 | 1 | 10 |
| 2009 | 3 | 5 |
| 2010 | 3 | 7 |
| 2011 | 3 | 9 |
| 2012 | 2 | 5 |
| 2013 | 4 | 3 |
| 2014 | 4 | 6 |
| 2015 | 3 | 3 |
| 2016 | 2 | 5 |
| 2017 | 4 | 3 |
| 2018 | 4 | 2 |
| 2019 | 1 | 2 |
| 2020 | 3 | 4 |
| 2021 | 3 | 6 |
| 2022 | 1 | 6 |
| 2023 | 3 | 3 |
| 2024 | 8 | 6 |
| 2025 | 3 | 4 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Micro light-emitting package11 Aug 2026US 12,707,562 B2Ennostar Corporation
- Joint structure24 Mar 2026US 12,588,151 B2TDK Corporation
- Electronic device including shielding member including structure for reducing deformation27 Jan 2026US 12,538,412 B2Samsung Electronics Co., Ltd.
- Semiconductor package and semiconductor device30 Sep 2025US 12,431,439 B2Kioxia Corporation
- Manufacture of a curved electronic device using differential heating and curved electronic device1 Jul 2025US 12,349,272 B2Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Recyclable electronic device, and method and apparatus for manufacturing and recycling the device1 Oct 2026US 2026/0304602 A1Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Electronic device23 Jul 2026US 2026/0214796 A1AUO Corporation
- Semiconductor package and semiconductor device8 Jan 2026US 2026/0011657 A1Kioxia Corporation
- Grounding of integrated external emi shield of an optical sensor module11 Sep 2025US 2025/0287557 A1STMicroelectronics International N. V.
- Pcb including laser blocking portion and battery cell assembly including the same12 Jun 2025US 2025/0194003 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Semiconductor flip chip package145US 6,018,196 AW. L. Gore & Associates, Inc. · 2000
- Printed wiring board having highly reliably via hole and process for forming via hole129US 6,280,641 B1Mitsubishi Gas Chemical Company, Inc. · 2001
- Interconnect module with reduced power distribution impedance81US 6,847,527 B23M Innovative Properties Company · 2005
- Radiation switch for photoflash unit80US 4,336,570 AGTE Products Corporation · 1982
- Method of manufacturing circuit module58US 5,829,125 ATaiyo Yuden Co., Ltd. · 1998