Joint structure
AssigneeTDK Corporation
InventorsRyohei Kasai, Masaki Oikawa, Susumu Taniguchi, Kenichi Kawabata
Life of this patent
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AssigneeTDK Corporation
InventorsRyohei Kasai, Masaki Oikawa, Susumu Taniguchi, Kenichi Kawabata
Estimating the term…
A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a base material of the electronic component; a base material of the wiring substrate; and a joint portion that includes at least an electrode of the electronic component and an electrode of the wiring substrate, and that joins the base material of the electronic component and the base material of the wiring substrate. The joint portion includes a material having an absorption coefficient of 2×10{circumflex over ( )}5 cm−1 or more for light of a wavelength of 250 to 1000 nm. The base material of at least one component of the electronic component and the wiring substrate consists of a material having an absorption coefficient of 1.5×10{circumflex over ( )}5 cm−1 or less for the light of a wavelength of 250 to 1000 nm.
A joint structure in which an electronic component and a wiring substrate are joined to each other, the structure comprising:
Dependencies are inferred from the claim text.