Semiconductor flip chip package
AssigneeW. L. Gore & Associates, Inc.
InventorDavid B. Noddin
Life of this patent
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Abstract
A semiconductor flip chip package is provided having a semiconductor flip chip integrated circuit device and a laminated substrate. The laminated substrate has a conductive core and at least one lamina formed on the core layer. Each lamina has a dielectric layer and a conductive layer. The dielectric layer is formed at least in part from a fluoropolymer material having disposed therein an inorganic filler material. At least one via extends through the at least one lamina. The via has an entrance aperature of <75 microns and an aspect ratio of between 3:1 and 25;1. The laminated substrate includes a plurality of individual pads to which the individual solder ball connections of the semiconductor flip chip integrated circuit device are connected.
Claims3
A semiconductor chip package comprising:
- a semiconductor chip of the type having a plurality of individual solder ball connections on a mounting surface thereof;
- and
- a laminated substrate having at least a conductive core layer and at least one lamina formed on the core layer;
- wherein each lamina has a dielectric layer and a conductive layer, said dielectric layer being formed at least in part from a fluoropolymer material having disposed therein an inorganic filler material;
- wherein at least one via extends through said at least one lamina, said via having an entrance aperture in the conductive layer of <75 .mu.m and an aspect ratio of between 3:1 and 25:1;
- and
- wherein said laminated substrate includes a plurality of individual pads to which the individual solder ball connections of said semiconductor chip is connected.
Dependencies are inferred from the claim text.