Semiconductor package and semiconductor device
AssigneeKioxia Corporation
InventorsRyujiro Bando, Hitoshi Ikei
Life of this patent
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Abstract
A semiconductor package of an embodiment includes a wiring substrate, a semiconductor chip provided on an upper surface of the wiring substrate, a sealing resin covering surfaces of the wiring substrate and the semiconductor chip, an infrared reflection layer containing any of aluminum, aluminum oxide, and titanium oxide, and an external terminal provided on a lower surface of the wiring substrate. The wiring substrate is electrically connectable with a printed wiring board through the external terminal. The infrared reflection layer is provided to the sealing resin on an upper side of a surface of the semiconductor chip on a side opposite to an upper surface of the wiring substrate.
Claims7
A semiconductor device comprising:
- a semiconductor package including
- a wiring substrate having a first surface and a second surface on a side opposite to the first surface and covered by a white solder resist,
- a semiconductor chip provided on an upper side of the first surface of the wiring substrate,
- a sealing resin covering the first surface of the wiring substrate and the semiconductor chip, and
- an external terminal provided on the second surface of the wiring substrate, wherein
- the wiring substrate being electrically connectable with a printed wiring board through the external terminal;
- and
- a print wiring substrate including
- a mounting substrate,
- a wiring layer provided on an upper side of the mounting substrate and electrically connectable with the external terminal, and
- an infrared absorption layer provided on an upper side of the wiring layer and formed of any of carbon black, carbon nanotube, diamond-like carbon, or insulation paste containing microcrystal diamond.
A semiconductor device comprising:
- a semiconductor package including
- a wiring substrate having a first surface and a second surface on a side opposite to the first surface,
- a semiconductor chip provided on the first surface of the wiring substrate,
- a sealing resin covering the first surface of the wiring substrate and surfaces of the semiconductor chip, and
- an external terminal provided on the second surface of the wiring substrate;
- and
- a print wiring substrate including
- a mounting substrate,
- a wiring layer provided on an upper side of the mounting substrate and electrically connectable with the external terminal, and
- an infrared absorption layer provided on an upper side of the wiring layer and formed of any of carbon black, carbon nanotube, diamond-like carbon, or insulation paste containing microcrystal diamond, wherein
- the wiring substrate is electrically connectable with the printed wiring board through the external terminal.
Dependencies are inferred from the claim text.