Recyclable electronic device, and method and apparatus for manufacturing and recycling the device

An electronic device comprising a stack comprising:

• a first substrate provided on a first side of the stack;
• a second substrate provided on a second side of the stack opposite the first side of the stack;
• a circuit layer comprising circuit parts disposed between the first substrate and the second substrate, wherein the second substrate is shaped to encapsulate the circuit layer between the second substrate and the first substrate;
• at least one delamination layer covering a side of the circuit layer facing the second substrate and configured to separate the circuit parts from the second substrate, wherein the at least one delamination layer forms an adhesive connection between the circuit layer and the second substrate with a first adhesive strength;
• and
• a graphic layer disposed between the circuit layer and the first substrate, wherein the graphic layer comprises a pattern of one or more light reflecting areas and one or more light absorbing areas,
• wherein the one or more light reflecting areas are arranged to cover the circuit parts at the first side,
• wherein the one or more light absorbing areas are arranged at areas without the circuit parts and without the at least one delamination layer, forming an adhesive connection between the first substrate and the second substrate with a second adhesive strength higher than the first adhesive strength of the at least one delamination layer, and
• wherein the one or more light absorbing areas are configured to delaminate under the influence of light transmitted through the first substrate and absorbed by the one or more light absorbing areas, while the one or more light reflecting areas are configured to reflect the light.