H05K 2201/0125
Shrinkable
Official title: Shrinkable, e.g. heat-shrinkable polymer
H05K2201/0125 (Shrinkable) appears on 44 US grants and 31 published applications in this corpus.
Search patents in H05K- Granted patents
- 44
- Published applications
- 31
- Assignees
- 35
- Inventors
- 104
- Latest grant
- 28 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 1 | 1 |
| 2003 | 2 | 3 |
| 2004 | 3 | 3 |
| 2005 | 3 | 3 |
| 2006 | 2 | 2 |
| 2007 | 1 | 0 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 1 | 2 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 1 | 2 |
| 2020 | 1 | 2 |
| 2021 | 1 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 0 |
| 2024 | 0 | 3 |
| 2025 | 4 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- LCP extruded film and method for manufacturing the same, LCP extruded film for stretch treatment, LCP stretched film, heat-shrinkable LCP stretched film, insulating material for circuit substrate, and metal foil-clad laminate28 Oct 2025US 12,454,088 B2Denka Company Limited
- LCP extruded film and method for manufacturing the same, LCP extruded film for stretch treatment, LCP stretched film, heat-shrinkable LCP stretched film, insulating material for circuit substrate, and metal foil-clad laminate21 Oct 2025US 12,447,661 B2Denka Company Limited
- LCP extruded film and method for manufacturing the same, LCP extruded film for stretch treatment, LCP stretched film, heat-shrinkable LCP stretched film, insulating material for circuit substrate, and metal foil-clad laminate21 Oct 2025US 12,447,662 B2Denka Company Limited
- Branched proximal connectors for high density neural interfaces7 Jan 2025US 12,186,570 B2Verily Life Sciences LLC
- Patterned conductive microstructures within a heat shrinkable substrate25 Apr 2023US 11,638,348 B2Raytheon Company
- Lcp extruded film and method for manufacturing the same, lcp extruded film for stretch treatment, lcp stretched film, heat-shrinkable lcp stretched film, insulating material for circuit substrate, and metal foil-clad laminate8 Feb 2024US 2024/0043635 A1Denka Company Limited
- Lcp extruded film and method for manufacturing the same, lcp extruded film for stretch treatment, lcp stretched film, heat-shrinkable lcp stretched film, insulating material for circuit substrate, and metal foil-clad laminate25 Jan 2024US 2024/0025102 A1Denka Company Limited
- Lcp extruded film and method for manufacturing the same, lcp extruded film for stretch treatment, lcp stretched film, heat-shrinkable lcp stretched film, insulating material for circuit substrate, and metal foil-clad laminate25 Jan 2024US 2024/0032191 A1Denka Company Limited
- Branched Proximal Connectors For High Density Neural Interfaces13 Oct 2022US 2022/0323773 A1Verily Life Sciences LLC
- Film and laminate for electronic substrate, and electronic substrate including same13 Oct 2022US 2022/0330423 A1Skc Co., Ltd.
Most cited
By later US patents
- Method of making subsurface electronic circuits121US 5,531,020 APoly-Flex Circuits, Inc. · 1996
- Ball grid array package for enhanced stress tolerance65US 6,583,515 B1Texas Instruments Incorporated · 2003
- Solder delivery systems59US 4,712,721 ARaychem Corporation · 1987
- Method for mounting very small integrated circuit package on PCB52US 5,359,768 AIntel Corporation · 1994
- Method of disposing conductive bumps onto a semiconductor device51US 6,861,345 B2Micron Technology, Inc. · 2005