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US 4,712,721 AGranted
Solder delivery systems
AssigneeRaychem Corporation
InventorsRaymond Noel, William M. Robinson, Gabe Cherian, Thomas H. Clifford, William D. Carlomagno, William M. Deasy, Willie K. Grassauer, David K. Haygood, H. Paul Sherlock, Harry E. White
Life of this patent
Estimating the term…
Abstract
Mechanical means and methods for delivery of solder preforms arranged in generally rectilinear patterns and oriented so that the ends of the solder preforms may join two planar surfaces upon the application of heat are disclosed. Several embodiments facilitate the delivery of solder preforms in the forms of posts, clips and rings.
Claims24
A solder post delivery system comprising:
- a positioning means for positioning solder posts, said positioning means being elongated along a longitudinal axis, said positioning means having a plurality of longitudinally spaced openings therethrough, each of said openings having a top and a bottom generally parallel to said longitudinal axis wherein said positioning means is folded along a line generally parallel to the tops and bottoms of said openings providing unobstructed access to said solder posts;
- an elongated and flexible backing means having at least one adhesive surface, said backing means connected to said positioning means by said surface and to solder posts to be positioned through said openings;
- and
- a plurality of solder posts positioned by said openings and held therein by said backing means, said positioning means capable of being bent with respect to said longitudinal axis to align the ends of said solder posts with respect to electrical components to be interconnected.
1 more element
A solder post delivery system comprising:
- a positioning means for positioning solder posts, said positioning means including at least three layers of sheet-like material, each of said layers having a plurality of openings therethrough, the openings in each layer being in general axial alignment with the openings in the other layers, said openings being capable of being slightly misaligned by movement of the layers with respect to each other;
- and
- a plurality of solder posts, one solder post being positioned in each generally aligned opening and being secured therein by a force fit created by said slight misalignment.
A solder post delivery system comprising:
- a positioning means for positioning solder posts comprising a continuous frame having an inner and outer periphery, said frame capable of being discontinuous, said positioning means having securing portions which are capable of removably securing solder posts thereto when said frame is continuous and which are capable of releasing solder posts that may be secured thereto when said frame is discontinuous;
- and
- a plurality of solder posts in contact with said securing portions of said positioning means;
- and
- wherein said frame has a generally U-shaped cross-section having top and bottom flanges and a securing portion on the inner periphery of said frame comprising a plurality of spaced openings, each of said openings extending across the width of said inner periphery and into said top and bottom flange, each of said solder posts being positioned and held within one of said openings by contact with the edges of each of said openings.
2 more elements
A solder post delivery system comprising:
- a positioning means for positioning solder posts comprising a continuous frame having an inner and outer periphery, said frame capable of being discontinuous, said positioning means having securing portions which are capable of removably securing solder posts thereto when said frame is continuous and which are capable of releasing solder posts that may be secured thereto when said frame is discontinuous;
- and
- a plurality of solder posts in contact with said securing portions of said positioning means;
- and
- wherein the inner periphery of said frame is contoured to provide spaced securing portions thereof that are complementary to said solder posts to secure said solder posts thereto, said frame having corners, said frame being discontinuous at one of said corners of said frame including separate removable fastening means to hold said corner together, said other cameras being bendable in hinge-like fashion to open said frame with respect to said solder posts to release said solder posts from said securing portions.
2 more elements
A solider delivery system comprising:
- a positioning means for positioning solder posts, said positioning means having a plurality of openings therethrough;
- and
- a plurality of solder posts with one post per opening, said posts comprising solder paste which fills said openings to define individual solder posts;
- and
- wherein said positioning means and said solder paste are co-extruded in one direction to define a continuous composite, said composite being sliced through at an angle perpendicular to the direction of co-extrusion to define an individual solder delivery system.
2 more elements
A solder post delivery system comprising:
- a positioning means for positioning solder posts, said positioning means being generally planar and having a plurality of openings therethrough, said positioning means being made from a heat-recoverable polymeric material, said positioning means having a first dimension including a first thickness wherein said openings have a first diameter, said positioning means having a second dimension including a smaller, second thickness wherein said openings have a smaller second diameter;
- and
- a plurality of solder posts with one post per opening, said posts secured by a force fit within said openings when said openings are at said second diameter and being released when said openings are at said first diameter, said positioning means capable of going from said second dimension to said first dimension upon application of heat.
A solder clip delivery system comprising:
- a positioning means for positioning solder clips comprising a frame having top and bottom surfaces and an inner and an outer periphery, said inner periphery of said frame having portions having a solderable metal deposited thereon and having solder plated on said metal, to define individual solder clips;
- and
- wherein said frame is capable of being detached from said clips when heat is applied to said clips, heat melting said solder to cause a permanent joint between the metal and the component to be connected and loosening the frame from said metal.
A solder clip delivery system comprising:
- a positioning means for positioning solder clips comprising a frame having top and bottom surfaces and an inner and an outer periphery, said inner periphery of said frame having portions having a solderable metal deposited thereon and having solder plated on said metal, to define individual solder clips;
- and
- wherein said portions are inwardly projecting finger-like portions having metal deposited on the top surface thereof, said portions being bent out of the plane of said surface to form a generally C-shaped solder clip.
A solder ring delivery system comprising:
- a positioning means for positioning solder rings, said positioning means including a plurality of diametrically heat-recoverable rods, said rods being adjacent to each other in general spaced parallel relationship;
- and
- a plurality of solder rings positioned about said rods, said rods having surface portions about said rods upon which a solderable metal has been deposited and having solder plated on said metal, said metal and solder defining said solder rings, said rods being diametrically shrinkable upon application of heat and capable of being removed.
Dependencies are inferred from the claim text.