US 11,638,348 B2 · Patterned conductive microstructures within a heat shrinkable substrate

Abstract

A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

Claims15

Dependent claims

A conductive interconnect structure, comprising:

a polymeric substrate shrinkable from an unshrunk state to a shrunken state;
and
a plurality of compliant conductive microstructures attached to the polymeric substrate, each compliant conductive microstructure comprising a plurality of micro elements,
wherein, in response to selective application of heat, at least a portion of the polymeric substrate transitions from the unshrunk state to the shrunken state to increase an interconnect density of the plurality of compliant conductive microstructures, and
wherein an unshrunk portion of the polymeric substrate defines a first interconnect density region, and wherein a shrunk portion of the polymeric substrate defines a second interconnect density region, wherein a first section of the compliant conductive microstructures associated with the first interconnect density region extend continuously to a second section of the compliant conductive microstructures associated with the second interconnect density region.

2 more elements

An electrical conducting assembly, comprising:

a support body comprising a support surface;
a conductive interconnect structure carried by the support body about the support surface,
the conductive interconnect structure comprising:
a polymeric substrate shrinkable from an unshrunk state to a shrunken state;
and
a plurality of compliant conductive microstructures attached to the polymeric substrate, each conductive microstructure comprising a plurality of micro elements,
wherein, in response to selective application of heat, at least a portion of the polymeric substrate transitions from the unshrunk state to the shrunken state to increase an interconnect density of the plurality of compliant conductive microstructures, thereby conforming the conductive interconnect structure to the support surface of the support body, and
wherein an unshrunk portion of the polymeric substrate defines a first interconnect density region, and wherein a shrunk portion of the polymeric substrate defines a second interconnect density region, wherein a first section of the compliant conductive microstructures associated with the first interconnect density region extend continuously to a second section of the compliant conductive microstructures associated with the second interconnect density region.

5 more elements

Dependencies are inferred from the claim text.

Patterned conductive microstructures within a heat shrinkable substrate

Life of this patent

Patterned conductive microstructures within a heat shrinkable substrate

Life of this patent

Abstract

Claims15