US 6,861,345 B2 · Method of disposing conductive bumps onto a semiconductor device

Abstract

A method of forming conductive structures on the contact pads of a substrate,such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.

Claims32

Dependent claims

A method of disposing a conductive structure on at least one contact pad on an active surface of a semiconductor device substrate, comprising:

disposing a layer comprising polymeric material over the substrate;
imparting said layer with a thickness substantially equal to a desired height of the conductive structure;
forming at least one aperture through said layer to expose at least a portion of the at least one contact pad;
disposing a quantity of conductive material on said layer and permitting said conductive material to substantially fill said at least one aperture;
bonding said conductive material within said at least one aperture to the at least one contact pad to form the conductive structure of substantially said desired height;
and
partially exposing a lateral periphery of the conductive structure through said layer.

4 more elements

Dependencies are inferred from the claim text.

Method of disposing conductive bumps onto a semiconductor device

Life of this patent

Method of disposing conductive bumps onto a semiconductor device

Life of this patent

Abstract

Claims32