H05K 2201/0129
Thermoplastic polymer
Official title: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
H05K2201/0129 (Thermoplastic polymer) appears on 882 US grants and 921 published applications in this corpus.
Search patents in H05K- Granted patents
- 882
- Published applications
- 921
- Assignees
- 459
- Inventors
- 2,253
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 6 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 4 | 0 |
| 1987 | 7 | 0 |
| 1988 | 12 | 0 |
| 1989 | 14 | 0 |
| 1990 | 8 | 0 |
| 1991 | 15 | 0 |
| 1992 | 12 | 0 |
| 1993 | 12 | 0 |
| 1994 | 20 | 0 |
| 1995 | 14 | 0 |
| 1996 | 9 | 0 |
| 1997 | 7 | 0 |
| 1998 | 13 | 0 |
| 1999 | 14 | 0 |
| 2000 | 16 | 0 |
| 2001 | 22 | 10 |
| 2002 | 22 | 30 |
| 2003 | 30 | 51 |
| 2004 | 26 | 44 |
| 2005 | 24 | 39 |
| 2006 | 17 | 23 |
| 2007 | 25 | 21 |
| 2008 | 15 | 40 |
| 2009 | 10 | 50 |
| 2010 | 21 | 31 |
| 2011 | 19 | 22 |
| 2012 | 30 | 24 |
| 2013 | 18 | 21 |
| 2014 | 13 | 32 |
| 2015 | 18 | 21 |
| 2016 | 17 | 52 |
| 2017 | 26 | 34 |
| 2018 | 42 | 64 |
| 2019 | 58 | 48 |
| 2020 | 45 | 46 |
| 2021 | 38 | 56 |
| 2022 | 44 | 39 |
| 2023 | 25 | 41 |
| 2024 | 44 | 30 |
| 2025 | 25 | 30 |
| 2026 | 12 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of furnishing three-dimensional objects with electrically conductive structures having low topography and low surface roughness8 Sep 2026US 12,733,110 B2Iee International Electronics & Engineering S.A.
- Flexible printed circuit, ink and method for obtaining flexible printed circuit thereof11 Aug 2026US 12,707,565 B2Universidade De Coimbra
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Copper clad laminate and uses of the same28 Jul 2026US 12,696,386 B2Taiwan Union Technology Corporation
- Multilayer substrate and electronic device16 Jun 2026US 12,658,549 B2Murata Manufacturing Co., Ltd.
- Flexible laminate material1 Oct 2026US 2026/0295973 A1The Chemours Company Fc, LLC
- Adhesive agent composition, adhesive agent film for circuit connection, circuit connection structure, and method for manufacturing same24 Sep 2026US 2026/0293741 A1
- Multilayer substrate, method of manufacturing multilayer substrate, and electronic device10 Sep 2026US 2026/0271178 A1Murata Manufacturing Co., Ltd.
- Multilayer substrate10 Sep 2026US 2026/0271180 A1Murata Manufacturing Co., Ltd.
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Solid printed substrate and electronic circuit package using the same239US 5,639,990 AMitsui Toatsu Chemicals, Inc. · 1997
- Electrically conductive adhesive connecting arrays of conductors165US 4,113,981 ASeikosha Co., Ltd. · 1978
- Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier158US 6,406,990 B1OMRON Corporation · 2002
- Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier146US 6,664,645 B2OMRON Corporation · 2003
- Method of manufacturing a multilayer circuit board138US 5,046,238 ARogers Corporation · 1991