Electronic structure and a method of manufacturing such

Abstract

An electronic structure includes a plurality of subassemblies, wherein each subassembly includes a circuit design and or is configured to host at least one electrically functional element, wherein in at least one of the subassemblies at least one of the functional elements of the structure is a connector element, each subassembly being mechanically and electrically coupled to at least one other subassembly via at least one coupling element, wherein the subassemblies and coupling elements are modular entities joined together to establish the electronic structure, further wherein at least a portion of the electronic structure includes at least one molded plastic layer, the molded plastic layer being provided to at least partially embed, surround, or host coupling elements, preferably each coupling element, the molded plastic layer further being provided to at least partially embed, surround, or host subassemblies, preferably each subassembly.

Dependencies are inferred from the claim text.