Multilayer substrate, method of manufacturing multilayer substrate, and electronic device

A multilayer substrate comprising:

• a plurality of base material layers and a conductor pattern and configured stacked on each other;
• a first portion;
• and
• a second portion;
• wherein front and back surfaces of the second portion are planes;
• a same layer of the base material layers is provided across the first portion and the second portion;
• at least a portion of the conductor pattern is provided across the first portion and the second portion, in an inside of the multilayer substrate;
• in the first portion, the conductor pattern is directly in contact with the base material layers;
• an upper-surface portion, and a side-surface portion provided so as to surround the upper-surface portion along an edge of the upper-surface portion, are provided;
• at least a portion of the first portion is bent and provided at the side-surface portion, or at a boundary between the upper-surface portion and the side-surface portion;
• and
• at least a portion of the second portion is provided at the upper-surface portion.

A multilayer substrate comprising:

• a plurality of base material layers and a conductor pattern stacked on each other;
• a first portion;
• and
• a second portion;
• wherein
• front and back surfaces of the second portion are planes;
• a same layer of the base material layers is provided across the first portion and the second portion;
• at least a portion of the conductor pattern is provided across the first portion and the second portion, in an inside of the multilayer substrate;
• in the first portion, the conductor pattern is directly in contact with the base material layers;
• the first portion, as viewed in a stacking direction of the base material layers of the second portion, defines a closed loop;
• and
• a cross-section of the first portion perpendicular to a direction along the first portion is bent.