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AssigneeOMRON Corporation
InventorWakahiro Kawai
Estimating the term…
To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.
A method of mounting a semiconductor chip on a circuit board, said semiconductor chip having a terminal bump, said circuit board having a wiring pattern with an electrode area and a thermoplastic resin coat covering the electrode area of the wiring pattern, said method comprising the steps of:
A method of manufacturing an electromagnetic wave readable data carrier having a body of a data carrier and an electronic component module, said body of the data carrier having an insulating base material and a conductive pattern held on the insulating base material, said electronic component module having a circuit board and a semiconductor chip with a terminal bump mounted on the circuit board, said circuit board having a wiring pattern with an electrode area and a thermoplastic resin coat covering the electrode area of the wiring pattern, said method comprising the steps of:
Dependencies are inferred from the claim text.