H05K 2201/012
Flame-retardant
Official title: Flame-retardant; Preventing of inflammation
H05K2201/012 (Flame-retardant) appears on 353 US grants and 403 published applications in this corpus.
Search patents in H05K- Granted patents
- 353
- Published applications
- 403
- Assignees
- 194
- Inventors
- 872
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 3 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 6 | 0 |
| 2000 | 2 | 0 |
| 2001 | 7 | 3 |
| 2002 | 6 | 4 |
| 2003 | 8 | 8 |
| 2004 | 6 | 7 |
| 2005 | 3 | 14 |
| 2006 | 3 | 12 |
| 2007 | 6 | 8 |
| 2008 | 5 | 13 |
| 2009 | 8 | 10 |
| 2010 | 7 | 16 |
| 2011 | 4 | 8 |
| 2012 | 11 | 14 |
| 2013 | 6 | 17 |
| 2014 | 8 | 23 |
| 2015 | 13 | 21 |
| 2016 | 16 | 36 |
| 2017 | 22 | 28 |
| 2018 | 31 | 34 |
| 2019 | 35 | 33 |
| 2020 | 24 | 46 |
| 2021 | 21 | 9 |
| 2022 | 27 | 9 |
| 2023 | 15 | 9 |
| 2024 | 9 | 8 |
| 2025 | 6 | 4 |
| 2026 | 3 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Phosphorus-containing compound, manufacturing method thereof, resin composition, and article made therefrom31 Mar 2026US 12,590,109 B2Elite Electronic Material (Kunshan) Co., Ltd.
- Package structure and electronic device10 Feb 2026US 12,550,250 B2Huawei Digital Power Technologies Co., Ltd.
- Leakage characterization for electronic circuit temperature monitoring27 Jan 2026US 12,535,537 B2International Business Machines Corporation
- Flame-retardant composition4 Nov 2025US 12,460,136 B2Chang Chun Plastics Co., Ltd.
- Aerosol generating device3 Jun 2025US 12,317,923 B2Kt&G Corporation
- Resin composition, prepreg, laminate, resin film, printed wiring board, and semi-conductor package24 Sep 2026US 2026/0286119 A1Resonac Corporation
- Phosphorus-containing (meth)acryloyl compound, phosphorus-containing vinyl benzyl compound, production methods therefor, and flame-retardant resin composition and laminated board for electronic circuit board containing same13 Aug 2026US 2026/0234170 A1Nippon Steel Chemical & Material Co., Ltd.
- Flame retardant and use thereof13 Aug 2026US 2026/0234171 A1Shikoku Chemicals Corporation
- Resin composition, prepreg, resin film, laminate, printed wiring board, and semiconductor package13 Aug 2026US 2026/0234391 A1Resonac Corporation
- Phosphorus-containing (meth)acryloyl compound, phosphorus-containing vinyl benzyl compound, production methods therefor, flame-retardant resin composition and laminated board for electronic circuit board containing same6 Aug 2026US 2026/0226082 A1Nippon Steel Chemical & Material Co., Ltd.
Most cited
By later US patents
- Flame retardant, low dielectric constant microsphere filled laminate87US 5,126,192 AInternational Business Machines Corporation · 1992
- Prepreg for printed circuit board and substrate for printed circuit using said prepreg82US 5,733,823 AIdemitsu Petrochemical Co., Ltd. · 1998
- Cleaning and drying of electronic assemblies68US 5,055,138 AI.S. C. Chemicals Limited · 1991
- Flame retardant B-staged epoxy resin prepregs and laminates made therefrom67US 4,501,787 AWestinghouse Electric Corp. · 1985
- Circuit board prepreg with reduced dielectric constant47US 5,670,250 APolyclad Laminates, Inc. · 1997