Package structure and electronic device
AssigneeHuawei Digital Power Technologies Co., Ltd.
InventorXiaojing Liao
Life of this patent
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Abstract
A package structure includes a protection structure, a circuit board, and a chip. The circuit board includes a first cabling layer, a dielectric layer, and a second cabling layer that are laminated. The protection structure is disposed inside the dielectric layer. The protection structure is configured to electrically connect the first cabling layer to the second cabling layer, and the chip is electrically connected to the first cabling layer or the second cabling layer. When the chip is short-circuited, the protection structure blows first.
Claims20
A package structure, comprising:
- a circuit board, comprising:
- a dielectric layer having a first dielectric layer side and a second dielectric layer side;
- a first cabling layer located on the first dielectric layer side and having a first melting point, and
- a second cabling layer located on the second dielectric layer side and having a second melting point;
- a protection structure located inside the dielectric layer is and configured to electrically connect the first cabling layer to the second cabling layer, wherein the protection structure is made of a hot-melt material that has a third melting point;
- and
- a chip packaged on the circuit board and electrically connected to either the first cabling layer or the second cabling layer, wherein the chip is configured to receive a current from the protection structure and through either the first cabling layer or the second cabling layer to the chip;
- and
- wherein the third melting point is lower than the first melting point or the second melting point through which the current flows such that the protection structure is configured to blow when the chip is short-circuited.
An electronic device, comprising:
- a housing;
- and
- a package structure disposed inside the housing, wherein the package structure comprises:
- a circuit board comprising:
- a dielectric layer having a first dielectric layer side and a second dielectric layer side:
- a first cabling layer located on the first dielectric layer side and having a first melting point, and
- a second cabling layer located on the second dielectric layer side and having a second melting point;
- a protection structure located inside the dielectric layer and configured to electrically connect the first cabling layer to the second cabling layer, wherein the protection structure is made of a hot-melt material that has a third melting point;
- and
- a chip packaged on the circuit board and electrically connected to either the first cabling layer or the second cabling layer, wherein the chip is configured to receive a current from the protection structure and through either the first cabling layer or the second cabling layer to the chip;
- and
- wherein the third melting point is lower than the first melting point or the second melting point through which the current flows such that the protection structure is configured to blow when the chip is short-circuited.
Dependencies are inferred from the claim text.