H05K 2201/0183
Dielectric layers
H05K2201/0183 (Dielectric layers) appears on 2,135 US grants and 2,228 published applications in this corpus.
Search patents in H05K- Granted patents
- 2,135
- Published applications
- 2,228
- Assignees
- 773
- Inventors
- 4,594
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 3 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 3 | 0 |
| 1985 | 10 | 0 |
| 1986 | 6 | 0 |
| 1987 | 10 | 0 |
| 1988 | 13 | 0 |
| 1989 | 15 | 0 |
| 1990 | 23 | 0 |
| 1991 | 27 | 0 |
| 1992 | 25 | 0 |
| 1993 | 21 | 0 |
| 1994 | 26 | 0 |
| 1995 | 24 | 0 |
| 1996 | 21 | 0 |
| 1997 | 21 | 0 |
| 1998 | 35 | 0 |
| 1999 | 34 | 0 |
| 2000 | 31 | 0 |
| 2001 | 45 | 23 |
| 2002 | 51 | 73 |
| 2003 | 59 | 64 |
| 2004 | 73 | 94 |
| 2005 | 50 | 83 |
| 2006 | 53 | 81 |
| 2007 | 43 | 107 |
| 2008 | 58 | 108 |
| 2009 | 56 | 140 |
| 2010 | 64 | 123 |
| 2011 | 79 | 79 |
| 2012 | 91 | 84 |
| 2013 | 79 | 68 |
| 2014 | 77 | 100 |
| 2015 | 89 | 119 |
| 2016 | 79 | 90 |
| 2017 | 94 | 86 |
| 2018 | 67 | 94 |
| 2019 | 87 | 97 |
| 2020 | 106 | 106 |
| 2021 | 74 | 95 |
| 2022 | 63 | 83 |
| 2023 | 76 | 89 |
| 2024 | 72 | 58 |
| 2025 | 51 | 38 |
| 2026 | 39 | 46 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate15 Sep 2026US 12,739,968 B2Murata Manufacturing Co., Ltd.
- Multilayer substrate, electronic apparatus, and method for manufacturing multilayer substrate25 Aug 2026US 12,720,669 B2Murata Manufacturing Co., Ltd.
- Adhesive film for circuit connection, and circuit connection structure and manufacturing method therefor18 Aug 2026US 12,709,083 B2Resonac Corporation
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- Printed circuit board18 Aug 2026US 12,713,531 B2Samsung Electro-Mechanics Co., Ltd.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
- Higher current surface mount pads and circuit assembly24 Sep 2026US 2026/0292979 A1
- Method for manufacturing circuit connection structure, adhesive film for circuit connection, and circuit connection structure24 Sep 2026US 2026/0292990 A1
- Flexible circuit board and electronic device10 Sep 2026US 2026/0271179 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Method for making an electronic module391US 5,745,984 AMartin Marietta Corporation · 1998
- Semiconductor devices having protective layers thereon through which contact pads are exposed and stereolithographic methods of fabricating such semiconductor devices266US 6,326,698 B1Micron Technology, Inc. · 2001
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993