Method of forming a three-dimensional printed circuit assembly
AssigneeMotorola, Inc.
InventorsFrank J. Juskey, Anthony B. Suppelsa, Dale W. Dorinski
Life of this patent
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Abstract
A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.
Claims14
A method of making a three-dimensional printed circuit assembly, comprising the steps of:
- forming a substrate from a photoactive polymer capable of altering its physical state when exposed to a radiant beam, the substrate being only partially cured;
- forming a conductive circuit pattern on the substrate;
- conforming the substrate to create a three-dimensional printed circuit assembly;
- and
- curing the three-dimensional printed circuit assembly to cause the photoactive polymer to harden further.
A method of making a three-dimensional printed circuit assembly, comprising the steps of:
- forming a substrate by means of stereolithography, the substrate being only partially cured;
- forming a conductive circuit pattern on the substrate;
- shaping the substrate to provide three-dimensional features by heating and softening the substrate to conform it to the shape of a mold form, thereby creating a three dimensional printed circuit assembly;
- curing the shaped substrate to cause it to crosslink;
- and
- populating the substrate with components.
A method of making a three-dimensional printed circuit, comprising the steps of:
- forming a substrate by;
- selectively exposing a working surface of a liquid photopolymer to a radiant beam to partially cure the photopolymer and create a first layer of the substrate;
- applying a coating of the liquid photopolymer to the first layer of the substrate;
- selectively exposing the coating to the radiant beam to continue to form the substrate;
- and
- repeating the steps of applying a coating and selectively exposing, to form a plurality of successive layers comprising a substrate;
- forming a conductive circuit pattern on the substrate;
- shaping the substrate to provide a three-dimensional printed circuit by heating and softening the substrate to cause it to assume the shape of a mold form;
- and
- curing the substrate further to cause the partially cured photopolymer to harden in the shape of the mold form.
Dependencies are inferred from the claim text.